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L6260J-DIE
3.3V DISK DRIVER SPINDLE & VCM, POWER & CONTROL COMBO'S
DATA BRIEF
1

GENERAL FEATURES
BICMOS TECHNOLOGY 3.3V OPERATION REGISTER BASED ARCHITECTURE MINIMUM EXTERNAL COMPONENTS SLEEP AND IDLE MODES FOR LOW POWER CONSUMPTION SELECTABLE GAINS FOR BOTH V.C.M. AND SPINDLE 10 BIT (+ SIGN + GAIN ) VCM & 8 BIT SPINDLE DACs HIGH BANDWIDTH SPEED REGULATION LOOP (ONCE PER MECH\ELEC CYCLE ACCURACY)
Figure 1.

DIE
Table 1. Order Codes
Part Number L6260J-DIE DIE

1.1 VCM DRIVER

CURRENT SENSE CONTROL (VOLTAGE PROPORTIONAL TO CURRENT) 300mA DRIVE CAPABILITY TWO CURRENT RANGES FOR SEEKING AND TRACKING INTERNAL REGISTER FOR POWER AMP CONTROL LINES
POWER DOWN SEQUENCING LOW VOLTAGE SENSE ACTUATOR RETRACTION DYNAMIC BRAKE THERMAL SHUTDOWN THERMAL & CURRENT PROTECTION
2
DESCRIPTION
1.2 SPINDLE DRIVERS

BEMF PROCESSING FOR SENSORLESS MOTOR COMMUTATION PROGRAMMABLE COMMUTATION PHASE DELAY PROGRAMMABLE SLEW-RATE FOR REDUCED E.M.I. 0.8 FOR ANY HALF BRIDGE WORST CASE SYNCHRONOUS RECTIFICATION OF THE B.E.M.F. DURING RETRACT OPERATION BIPOLAR \ TRIPOLAR OPERATION SYNTHESIZED HALL OUTPUTS 1.0 AMP DRIVE CAPABILITY
The L6260J-DIE is a single chip sensorless (DC) spindle motor and voice coil controllers including power stages suitable for use in small disk drives. This device has a serial interface for a microprocessor running up to 10 Mega bits per second. There are registers on chip to allow the setting of the desired spindle speed via the on chip Frequency Locked Loop (F.L.L.). No external components are required in the sensor-less operation as the control functions are integrated on chip (e.g. B.E.M.F. processing, digital masking, digital delay and sequencing). The V.C.M. drivers uses a transconductance amplifier, able to provide 2 different current ranges, suitable for seeking and tracking. When a low voltage is detected, a Power On Reset (P.O.R.) is issued and the internal registers are reset, the spindle power circuitry is tri-stated, B.E.M.F. synchronous rectification is enabled, the actuator retracts and then dynamic braking of the spindle is applied. This device is built in BICMOS technology allowing dense digital circuitry to be combined with MOS\Bipolar power devices.
REV. 1 1/2
1.3 OTHER FUNCTIONS
POWER UP SEQUENCING
June 2004
This is preliminary information on a new product now in development. Details are subject to change without notice.
L6260J-DIE
Figure 2. Block Diagram
PARK/V VCM/COMP VCM/I/SNS/1 VCM/I/SNS/2 VCM/PLUS VCM/MINUS VREFOUT VREF/MINUS 177 + BIAS CIRCUIT VCM LOGIC & DAC VOLTAGE TRIPLER POWER MONITOR VCM PARK REGISTER 0 REGISTER 1 REGISTER 2 SDIO SCLK SLOAD R/W SERIAL PORT INTERFACE REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 TEST TRISTATE ATEST DTEST
D00IN1123
VVCM/2 VVCM/1 C1LOW C1HIGH C2LOW C2HIGH VHTRIP VLTRIP VPARKOUT CENTER TAP DRIVER CTAP SYNTH/HALL VRECT VSPIN/1 BEMF AMP SPINDLE BLOCK & DAC VSPIN/2 SPN/I/SNS COIL/A COIL/B COIL/C SPIN/GND1 SPIN/GND2 VPDOWN BRK/DLY SPN/I/COMP
DAC/GND UV1 SPN_DSBL_DLY POR/DLY POR FCLK
SPINDLE LOGIC
CURRENT GENERATOR SPINDLE FLL
SPN/SLEW FLL/RES
CHARGE PUMP
SPD/COMP SPD/COMP/SHT
ANALOG TEST CIRCUIT
DIGITAL TEST CIRCUIT
Table 2. Revision History
Date June 2004 Revision 1 First Issue Description of Changes
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com
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